IEEE AP-S Technical Committee (TC4) Workshop on
Metamaterials and Smart Electromagnetic Environments

Date: July 8, 2026

Venue: Computer Design Research and Learning Center, University of Illinois Chicago, Chicago, USA

Organizers and Chairs

Pai-Yen Chen, University of Illinois Chicago, USA (pychen@uic.edu)

Alessio Monti, Roma Tre University, Italy (alessio.monti@uniroma3.it)

Danilo Erricolo, University of Illinois Chicago, USA derric1@uic.edu)

Program Summary

The IEEE AP-S Technical Committee on Metamaterials (TC4) and the University of Illinois Chicago (UIC) will co-organize a full-day workshop on Metamaterials and Smart Electromagnetic Environments in Chicago, USA. This event convened leading researchers and engineers to examine transformative advancements in metasurfaces, reconfigurable intelligent surfaces (RIS), and next-generation antenna and wireless systems, as well as their cutting-edge integration with AI, digital twin, quantum and chip technologies.

The workshop commenced with welcoming remarks from Danilo Erricolo (UIC), who provided a strategic overview of IEEE AP-S initiatives designed to bolster the global antennas and electromagnetics research community. Following this, Pai-Yen Chen (UIC), Chair of the IEEE Chicago AP-S/MTT-S Joint Chapter, delivered an update on local chapter activities and professional development opportunities. Alessio Monti (Roma Tre University) then detailed the mission of TC4, highlighting its critical role in steering the evolution of metamaterial technologies.

The technical program showcased state-of-the-art electromagnetic research and emerging applications across wireless sensing and communications, biomedical, and quantum technologies. Serving as a dynamic and interactive forum, the workshop facilitated high-level knowledge exchange between leading experts, academia, industry, and IEEE Young Professionals.

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