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IEEE Electronic and Information Technology Conference 2023
May 18, 2023 @ 12:00 pm - May 20, 2023 @ 5:00 pm CDT
The IEEE 2023 International Electro/Information Technology Conference, sponsored by the IEEE Region 4 (R4), in collaboration with Lewis University, and the IEEE Chicago Section., is focused on basic/applied research results in the fields of electrical and computer engineering as they relate to Electrical and Computer Engineering, Information Technology, and related applications. The purpose of the conference is to provide a forum for researchers and industrial investigators to exchange ideas and discuss developments in these growing fields. There will also be exhibits where the latest electro/information technology tools and products will be showcased. This is also an opportunity for professional activities development, workshops and tutorials.
Topics of interest include but are not limited to:
- Robotics and Mechatronics
- Intelligent Systems and Multi-agent Systems
- Control Systems and System Identification
- Reconfigurable and Embedded Systems
- Power Systems and Power Electronics
- Solid State, Consumer and Automotive Electronics
- Electronic Design Automation
- Biomedical Applications, Telemedicine
- Biometrics and Bioinformatics
- Nanotechnology
- Micro Electromechanical Systems
- Electric Vehicles
- Wireless Communications and Networking
- Ad Hoc and Sensor Networks
- Internet of Things
- Artificial Intelligence and Machine Learning
- Cybersecurity
- Computer Vision
- Signal/Image and Video Processing
- Distributed Data Fusion and Mining
- Cloud, Mobile, and Distributed Computing
- Software Engineering and Middleware Architecture
- Engineering Education and Engineering Management
Register to attend the paper sessions, workshops, tutorials, keynotes, panels and Student Poster Contest at https://eit-conference.org/eit2023/reginfo.php. There are different fees for author and non-author participation.
The conference program can be found at https://eit-conference.org/eit2023/program.html.
We thank the gracious financial support of our sponsors: Panduit, MSOE University, Elite Electronic Engineering Inc., BONbLOC, Electric Materials Company and IEEE Chicago.
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Romeoville, IL