The IEEE 2023 International Electro/Information Technology Conference, sponsored by the IEEE Region 4 (R4), in collaboration with Lewis University, IEEE Section, is focused on basic/applied research results in the fields of electrical and computer engineering as they relate to Electrical and Computer Engineering, Information Technology, and related applications. The purpose of the conference is to provide a forum for researchers and industrial investigators to exchange ideas and discuss developments in these growing fields. There will also be exhibits where the latest electro/information technology tools and products will be showcased. This is also an opportunity for professional activities development, workshops and tutorials.


May 18-20, 2023
Lewis University, Romeoville, IL


R4 EIT Conference Administrator
James Riess,

EIT Conferences Founding General Chair
Hossein Mousavinezhad, Idaho State University

2023 Conference General co-Chairs
Gina Martinez, Bakul Banerjee,

Program Chairs
Constantin Apostoaia,
Subra Ganesan,
Osama Abuomar,

Finance Chair
Steve Kerchberger,

Professional Development Program Chairs
Tarek Lahdhiri,
Ray Klump,

Exhibits/Industry/Sponsorship Chairs
Hamid Vakilzadian,
John Zulaski,

Publicity Chair
Alvin Chin,

Local Arrangements Chair
Matt Plass,

Registration Chair
Mahmood Al-Khassaweneh,

Student Activities Chair
Sasidhar Tadanki,

Publication Chairs
Afshin Izadian,, IUPUI
Rahul Gomes,

International Liaisons
Chengying Xu,
Peter Dittrich,
Hongwei Zhang,
Hsiao-Hwa Chen,

eit 2023 Webmaster
Bob Evanich,

Awards Chairs
Sat Basu,,
Hossein Mousavinezhad,
Subra Ganesan,

Topics of interest include but are not limited to:

• Robotics and Mechatronics
• Intelligent Systems and Multi-agent Systems
• Control Systems and System Identification
• Reconfigurable and Embedded Systems
• Power Systems and Power Electronics
• Solid State, Consumer and Automotive Electronics • Electronic Design Automation
• Biomedical Applications, Telemedicine
• Biometrics and Bioinformatics
• Nanotechnology
• Micro Electromechanical Systems
• Wireless communications and Networking
• Ad Hoc and Sensor Networks
• Cyber Security
• Computer Vision
• Signal/Image and Video Processing
• Distributed Data Fusion and Mining
• Cloud, Mobile, and Distributed Computing
• Software Engineering and Middleware Architecture • Engineering Education

Important Dates

• Submission of full papers: March 7, 2023
• Notification of acceptance: April 7, 2023
• Final manuscript (PDF) due: April 21, 2023
• Early registration: April 15, 2023

Keynote Speakers: TBA

For more information, ideas for organizing/chairing sessions, industry participation, tutorials, professional activities sessions, please contact: Drs. Martinez or Mousavinezhad.